Zenode.ai Logo
Beta
SCS320AMC7G
Discrete Semiconductor Products

SCS320AMC7G

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 20 A, 47 NC, TO-220FM

Deep-Dive with AI

Search across all available documentation for this part.

SCS320AMC7G
Discrete Semiconductor Products

SCS320AMC7G

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 20 A, 47 NC, TO-220FM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS320AMC7G
Capacitance @ Vr, F1000 pF
Current - Reverse Leakage @ Vr100 µA
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-220-2 Full Pack
Reverse Recovery Time (trr)0 ns
Speed500 mA
Supplier Device PackageTO-220FM
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 475$ 7.70
NewarkEach 1$ 7.96
10$ 6.91
25$ 5.86
50$ 4.79
100$ 4.40
250$ 3.98
500$ 3.57

Description

General part information

SCS320AM Series

Shorter recovery time, enabling high-speed switching.

Documents

Technical documentation and resources

SCS320AMC7G | Datasheet

Datasheet

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

About Export Administration Regulations (EAR)

Export Information

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation

Package Information

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (SiC Power Device)

Thermal Design

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Explanation for Marking

Package Information

How to Create Symbols for PSpice Models

Models

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Compliance of the ELV directive

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Diode Types and Applications

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use Thermal Models

Thermal Design

Part Explanation

Application Note