Zenode.ai Logo
Beta
Product thumbnail image
Discrete Semiconductor Products

SST3906T116

Active
Rohm Semiconductor

BIPOLAR (BJT) SINGLE TRANSISTOR, PNP, 40 V, 200 MA, 350 MW, SOT-23, SURFACE MOUNT

Deep-Dive with AI

Search across all available documentation for this part.

Product thumbnail image
Discrete Semiconductor Products

SST3906T116

Active
Rohm Semiconductor

BIPOLAR (BJT) SINGLE TRANSISTOR, PNP, 40 V, 200 MA, 350 MW, SOT-23, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationSST3906T116
Current - Collector (Ic) (Max) [Max]200 mA
Current - Collector Cutoff (Max) [Max]50 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]350 mW
Supplier Device PackageSST3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]40 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 14606$ 0.26
NewarkEach (Supplied on Cut Tape) 1$ 0.19
10$ 0.12
25$ 0.10
50$ 0.08
100$ 0.06
250$ 0.06
500$ 0.06
1000$ 0.06

Description

General part information

SST3906 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Explanation for Marking

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

ESD Data

Characteristics Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

About Export Regulations

Export Information

Taping Information

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Flammability of Materials

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Anti-Whisker formation - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Types and Features of Transistors

Application Note

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Constitution Materials List

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

SST3906 Data Sheet

Data Sheet

Product Change Notice EN

Datasheet