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DTA115TKAT146
Discrete Semiconductor Products

2SB1695KT146

Active
Rohm Semiconductor

PNP, SOT-346, -30V -1.5A, LOW VCE(SAT) TRANSISTOR

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DTA115TKAT146
Discrete Semiconductor Products

2SB1695KT146

Active
Rohm Semiconductor

PNP, SOT-346, -30V -1.5A, LOW VCE(SAT) TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

Specification2SB1695KT146
Current - Collector (Ic) (Max) [Max]1.5 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition280 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
Supplier Device PackageSMT3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic370 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.69
10$ 0.43
100$ 0.27
500$ 0.21
1000$ 0.19
Digi-Reel® 1$ 0.69
10$ 0.43
100$ 0.27
500$ 0.21
1000$ 0.19
N/A 2802$ 0.69
Tape & Reel (TR) 3000$ 0.12

Description

General part information

2SB1695 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Transistor, MOSFET Flammability

Related Document

SMT3 T146 Taping Spec

Datasheet

SMT3 Part Marking

Related Document

Moisture Sensitivity Level - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

ESD Data

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What Is Thermal Design

Thermal Design

Types and Features of Transistors

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

Anti-Whisker formation - Transistors

Package Information

Compliance of the RoHS directive

Environmental Data

Reliability Test Result

Manufacturing Data

Package Dimensions

Package Information

How to Create Symbols for PSpice Models

Models

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Inner Structure

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

2SB1695K Data Sheet

Data Sheet

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design