Zenode.ai Logo
Beta
6-SON
Integrated Circuits (ICs)

SN74AUP1G08DRYR

Active
Texas Instruments

1-CH, 2-INPUT 0.8-V TO 3.6-V LOW POWER (< 1UA) AND GATE

Deep-Dive with AI

Search across all available documentation for this part.

6-SON
Integrated Circuits (ICs)

SN74AUP1G08DRYR

Active
Texas Instruments

1-CH, 2-INPUT 0.8-V TO 3.6-V LOW POWER (< 1UA) AND GATE

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP1G08DRYR
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Current - Quiescent (Max) [Max]500 nA
Input Logic Level - High [Max]2 V
Input Logic Level - High [Min]1.6 V
Logic TypeAND Gate
Max Propagation Delay @ V, Max CL6.2 ns
Mounting TypeSurface Mount
Number of Circuits1
Number of Inputs2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case6-UFDFN
Supplier Device Package6-SON (1.45x1)
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.46
10$ 0.40
25$ 0.37
100$ 0.30
250$ 0.28
500$ 0.23
1000$ 0.18
2500$ 0.16
Digi-Reel® 1$ 0.46
10$ 0.40
25$ 0.37
100$ 0.30
250$ 0.28
500$ 0.23
1000$ 0.18
2500$ 0.16
Tape & Reel (TR) 5000$ 0.10
Texas InstrumentsLARGE T&R 1$ 0.22
100$ 0.15
250$ 0.12
1000$ 0.08

Description

General part information

SN74AUP1G08-Q1 Series

The AUP family is TI’s premier solution to the low-power needs of the industry in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

This single 2-input positive-AND gate performs the Boolean function: Y = A • B or Y =A\ + B\in positive logic.

NanoStar package technology is a major breakthrough in integrated circuit (IC) packaging concepts, because it uses the die as the package.