Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SP3002-04UTG |
|---|---|
| Applications | General Purpose |
| Current - Peak Pulse (10/1000µs) | 4.5 A |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 C |
| Package / Case | 6-XDFN |
| Power Line Protection | True |
| Supplier Device Package | 6-µDFN (1.6x1.6) |
| Type | Steering (Rail to Rail) |
| Unidirectional Channels [custom] | 4 |
| Voltage - Clamping (Max) @ Ipp [Max] | 13 V |
| Voltage - Reverse Standoff (Typ) | 6 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 0.27 | |
Description
General part information
SP3002-04UTG Series
The SP3002 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.
Documents
Technical documentation and resources