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Integrated Circuits (ICs)

TIOL1125DRCR

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Texas Instruments

IO-LINK DEVICE TRANSCEIVER WITH LOW RESIDUAL VOLTAGE, INTEGRATED SURGE PROTECTION, & 5-V LDO OUTPUT

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VSON (DRC)
Integrated Circuits (ICs)

TIOL1125DRCR

Active
Texas Instruments

IO-LINK DEVICE TRANSCEIVER WITH LOW RESIDUAL VOLTAGE, INTEGRATED SURGE PROTECTION, & 5-V LDO OUTPUT

Technical Specifications

Parameters and characteristics for this part

SpecificationTIOL1125DRCR
Data Rate250 KBd
DuplexHalf
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case10-VFDFN Exposed Pad
ProtocolI/O-Link
Receiver Hysteresis750 mV
Supplier Device Package10-VSON (3x3)
TypeTransceiver
Voltage - Supply [Max]36 V
Voltage - Supply [Min]7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 5000$ 1.93
Texas InstrumentsLARGE T&R 1$ 2.70
100$ 2.37
250$ 1.66
1000$ 1.34

Description

General part information

TIOL1125 Series

The TIOL112(x) family of transceivers implements the IO-Link interface for industrial bidirectional, point-to-point communication. When the device is connected to an IO-Link master through a three-wire interface, the master initiates communication and exchange data with the remote node while the TIOL112(x) acts as a complete physical layer for the communication.

These devices are capable of withstanding up to 1.2 kV (500 Ω) of IEC 61000-4-5 surge and feature integrated reverse polarity protection. A simple pin-programmable interface allows easy interfacing with the controller circuits. The output current limit can be configured using an external resistor. TIOL112(x) can be configured to generate wake-up pulse and be used in IO-link master applications. Fault reporting and internal protection functions are provided for undervoltage, overcurrent and overtemperature conditions.

The TIOL112(x) family of transceivers implements the IO-Link interface for industrial bidirectional, point-to-point communication. When the device is connected to an IO-Link master through a three-wire interface, the master initiates communication and exchange data with the remote node while the TIOL112(x) acts as a complete physical layer for the communication.