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Discrete Semiconductor Products

UT6JA2TCR

Active
Rohm Semiconductor

-30V PCH+PCH MIDDLE POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

UT6JA2TCR

Active
Rohm Semiconductor

-30V PCH+PCH MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationUT6JA2TCR
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C4 A
Drain to Source Voltage (Vdss)30 V
Gate Charge (Qg) (Max) @ Vgs6.7 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]305 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case6-PowerUDFN
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs70 mOhm
Supplier Device PackageHUML2020L8
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.80
10$ 0.69
100$ 0.48
500$ 0.40
1000$ 0.34
Digi-Reel® 1$ 0.80
10$ 0.69
100$ 0.48
500$ 0.40
1000$ 0.34
N/A 10804$ 0.83
Tape & Reel (TR) 3000$ 0.26

Description

General part information

UT6JA2 Series

UT6JA2 is low on-resistance and small surface mount package MOSFET for switching application.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

About Flammability of Materials

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Explanation for Marking

Package Information

About Export Regulations

Export Information

UT6JA2 Data Sheet

Data Sheet

Taping Information

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

ESD Data

Characteristics Data

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

How to Create Symbols for PSpice Models

Models

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

Part Explanation

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Inner Structure

Package Information

P-channel Power MOSFETs selection guide

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Anti-Whisker formation - Transistors

Package Information