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EMX51T2R
Discrete Semiconductor Products

EMX51T2R

Active
Rohm Semiconductor

NPN+NPN, SOT-563, DRIVER TRANSISTOR

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EMX51T2R
Discrete Semiconductor Products

EMX51T2R

Active
Rohm Semiconductor

NPN+NPN, SOT-563, DRIVER TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationEMX51T2R
Current - Collector (Ic) (Max) [Max]200 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition400 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-563, SOT-666
Supplier Device PackageEMT6
Transistor Type2 NPN (Dual)
Voltage - Collector Emitter Breakdown (Max) [Max]20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 7122$ 0.34

Description

General part information

EMX51 Series

Two 2SCR522 chips in one package.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Taping Information

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Types and Features of Transistors

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

EMX51 Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Create Symbols for PSpice Models

Models

What is a Thermal Model? (Transistor)

Thermal Design

Inner Structure

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models

Schematic Design & Verification

ESD Data

Characteristics Data

Constitution Materials List

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification