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ROHM QH8JC5TCR
Discrete Semiconductor Products

QS8J13TR

Active
Rohm Semiconductor

DUAL MOSFET, DUAL P CHANNEL, -5.5 A, -12 V, 0.015 OHM, -4.5 V, -1 V ROHS COMPLIANT: YES

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ROHM QH8JC5TCR
Discrete Semiconductor Products

QS8J13TR

Active
Rohm Semiconductor

DUAL MOSFET, DUAL P CHANNEL, -5.5 A, -12 V, 0.015 OHM, -4.5 V, -1 V ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationQS8J13TR
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C5.5 A
Drain to Source Voltage (Vdss)12 V
FET FeatureLogic Level Gate
Gate Charge (Qg) (Max) @ Vgs [Max]60 nC
Input Capacitance (Ciss) (Max) @ Vds6300 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Power - Max [Max]1.25 W
Rds On (Max) @ Id, Vgs [Max]22 mOhm
Supplier Device PackageTSMT8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.83
10$ 0.72
100$ 0.50
500$ 0.41
1000$ 0.35
Digi-Reel® 1$ 0.83
10$ 0.72
100$ 0.50
500$ 0.41
1000$ 0.35
N/A 0$ 1.25
Tape & Reel (TR) 3000$ 0.31
6000$ 0.30
9000$ 0.28
30000$ 0.27
NewarkEach 1$ 1.22
10$ 0.77
100$ 0.52
500$ 0.42
1000$ 0.36
2500$ 0.32
12000$ 0.28

Description

General part information

QS8J13 Series

The Power MOSFET QS8J13 is suitable for switching power supply.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Reliability Test Result

Manufacturing Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Taping Information

Package Information

About Export Regulations

Export Information

Inner Structure

Package Information

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Explanation for Marking

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Package Dimensions

Package Information

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

ESD Data

Characteristics Data

Part Explanation

Application Note

Types and Features of Transistors

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Create Symbols for PSpice Models

Models