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20 LSSOP
Integrated Circuits (ICs)

R5F211A4SP#W4

Obsolete
Renesas Electronics Corporation

16-BIT MICROCONTROLLERS WITH R8C CPU CORE (NON PROMOTION)

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20 LSSOP
Integrated Circuits (ICs)

R5F211A4SP#W4

Obsolete
Renesas Electronics Corporation

16-BIT MICROCONTROLLERS WITH R8C CPU CORE (NON PROMOTION)

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationR5F211A4SP#W4
ConnectivityI2C, SSU, UART/USART, SIO
Core ProcessorR8C
Core Size16-Bit
Data Converters [custom]10
Data Converters [custom]4
Mounting TypeSurface Mount
Number of I/O13
Operating Temperature [Max]85 C
Operating Temperature [Min]-20 °C
Oscillator TypeInternal
Package / Case20-LSSOP
Package / Case [x]0.173 in, 4.4 mm
PeripheralsWDT, POR, LED, Voltage Detect
Program Memory Size16 KB
Program Memory TypeFLASH
RAM Size1 K
Speed20 MHz
Supplier Device Package20-LSSOP
Voltage - Supply (Vcc/Vdd) [Max]5.5 V
Voltage - Supply (Vcc/Vdd) [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

R5F211A Series

The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.

These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/19 Group has on-chip data flash ROM (1KB × 2 blocks). The difference between the R8C/18 Group and R8C/19 Group is only the presence or absence of data flash ROM. Their peripheral functions are the same.

Documents

Technical documentation and resources