Zenode.ai Logo
Beta
TUMT6_TUMT6 Pkg
Discrete Semiconductor Products

US6T8TR

Active
Rohm Semiconductor

PNP+PNP, SOT-363T, DRIVER TRANSISTOR

Deep-Dive with AI

Search across all available documentation for this part.

TUMT6_TUMT6 Pkg
Discrete Semiconductor Products

US6T8TR

Active
Rohm Semiconductor

PNP+PNP, SOT-363T, DRIVER TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationUS6T8TR
Current - Collector (Ic) (Max) [Max]1.5 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition400 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power - Max [Max]400 mW
Supplier Device PackageTUMT6
Transistor Type2 PNP (Dual)
Vce Saturation (Max) @ Ib, Ic200 mV
Voltage - Collector Emitter Breakdown (Max) [Max]12 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.57
10$ 0.49
100$ 0.34
500$ 0.28
1000$ 0.24
Digi-Reel® 1$ 0.57
10$ 0.49
100$ 0.34
500$ 0.28
1000$ 0.24
N/A 2786$ 0.95
Tape & Reel (TR) 3000$ 0.19

Description

General part information

US6T8 Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

US6T8 Data Sheet

Data Sheet

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Explanation for Marking

Package Information

Inner Structure

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

US6T8 ESD Data

Characteristics Data

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

Taping Information

Package Information

About Export Regulations

Export Information

Anti-Whisker formation - Transistors

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design