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SH2102WNAMU03
Discrete Semiconductor Products

SH2102WNAMU03

Active
Rohm Semiconductor

650V 50A, FRD BARE DIE FOR IGBT MODULE

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Search across all available documentation for this part.

DocumentsGeneration Mechanism of Voltage Surge on Commutation Side (Basic)Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)+34
SH2102WNAMU03
Discrete Semiconductor Products

SH2102WNAMU03

Active
Rohm Semiconductor

650V 50A, FRD BARE DIE FOR IGBT MODULE

Deep-Dive with AI

DocumentsGeneration Mechanism of Voltage Surge on Commutation Side (Basic)Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)+34

Technical Specifications

Parameters and characteristics for this part

SpecificationSH2102WNAMU03
null

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.00

Description

General part information

SH2102WN Series

Application: Free WheelingFor sale of Bare Die, please contact the specifications in our sales office. Currently, we don't sell Bare Die on the internet distributors now.

Documents

Technical documentation and resources

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Part Explanation

Application Note

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

What Is Thermal Design

Thermal Design

Types and Features of Transistors

Application Note

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

SH2102WN Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the ELV directive

Environmental Data

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper