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RGPR20NL43HRTL
Discrete Semiconductor Products

RGPR20NL43HRTL

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Rohm Semiconductor

430V 20A, LPDL, IGNITION IGBT FOR AUTOMOTIVE

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RGPR20NL43HRTL
Discrete Semiconductor Products

RGPR20NL43HRTL

Active
Rohm Semiconductor

430V 20A, LPDL, IGNITION IGBT FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRGPR20NL43HRTL
Current - Collector (Ic) (Max) [Max]20 A
Gate Charge14 nC
Mounting TypeSurface Mount
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Power - Max [Max]107 W
Supplier Device PackageTO-263L
Td (on/off) @ 25°C1.3 µs, 170 ns
Test Condition8 A, 100 Ohm, 300 V, 5 V
Vce(on) (Max) @ Vge, Ic2 V
Voltage - Collector Emitter Breakdown (Max) [Max]460 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.85
10$ 2.52
100$ 1.77
500$ 1.45
Digi-Reel® 1$ 3.85
10$ 2.52
100$ 1.77
500$ 1.45
N/A 993$ 3.83
Tape & Reel (TR) 1000$ 1.34
2000$ 1.27

Description

General part information

RGPR20 Series

RGPR20NL43HR is the Insulated Gate Bipolar Transistor (IGBT) for automotive ignition coil driver circuits and solenoid driver circuits.

Documents

Technical documentation and resources

Datasheet

Datasheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Moisture Sensitivity Level

Package Information

Compliance of the ELV directive

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

How to Use LTspice&reg; Models

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Package Dimensions

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Anti-Whisker formation

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design