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Discrete Semiconductor Products

RGC80TSX8RGC11

NRND
Rohm Semiconductor

REVERSE CONDUCTING TYPE, 1800V 40A, INTEGRATED DIODE, TO-247N, FIELD STOP TRENCH IGBT

Product dimension image
Discrete Semiconductor Products

RGC80TSX8RGC11

NRND
Rohm Semiconductor

REVERSE CONDUCTING TYPE, 1800V 40A, INTEGRATED DIODE, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGC80TSX8RGC11
Current - Collector (Ic) (Max) [Max]80 A
Current - Collector Pulsed (Icm)120 A
Gate Charge468 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]535 W
Supplier Device PackageTO-247N
Switching Energy1.6 mJ, 1.85 mJ
Td (on/off) @ 25°C [custom]80 ns
Td (on/off) @ 25°C [custom]565 ns
Test Condition40 A, 600 V, 15 V, 10 Ohm
Vce(on) (Max) @ Vge, Ic5 V
Voltage - Collector Emitter Breakdown (Max) [Max]1800 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 457$ 10.47
NewarkEach 1$ 9.43
10$ 7.57
25$ 6.04
50$ 5.57
100$ 5.11
250$ 5.10
900$ 5.08

Description

General part information

RGC80TSX8R Series

RGC80TSX8R is the reverse conducting IGBT for voltage-resonance inverter, IH applications.

Documents

Technical documentation and resources

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Compliance of the ELV directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Simulation Guide for PTC Heater Thermal Simulation (ROHM Solution Simulator)

Simulations

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (IGBT)

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation

Package Information

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

About Flammability of Materials

Environmental Data

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

About Export Administration Regulations (EAR)

Export Information

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Package Dimensions

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Technical Data Sheet EN

Datasheet