Specification	TMP006BIYZFT

Accuracy - Highest (Lowest)	1 °C, 1.5 °C
Features	Shutdown Mode
Mounting Type	Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Output Type	I2C/SMBus
Resolution	15 b
Sensing Temperature - Local [Max]	125 °C
Sensing Temperature - Local [Min]	-40 °C
Sensing Temperature - Remote [Max]	60 °C
Sensing Temperature - Remote [Min]	20 °C
Sensor Type	Infrared (IR), Digital
Supplier Device Package	8-DSBGA
Test Condition	0°C ~ 60°C (-40°C ~ 125°C)
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	2.2 V

TMP006 Series

Infrared Thermopile Contactless Temperature Sensor in WCSP Package

Part	Test Condition	Accuracy - Highest (Lowest)	Sensor Type	Mounting Type	Sensing Temperature - Remote [Min]	Sensing Temperature - Remote [Max]	Voltage - Supply [Max]	Voltage - Supply [Min]	Resolution	Output Type	Supplier Device Package	Features	Operating Temperature [Max]	Operating Temperature [Min]	Sensing Temperature - Local [Max]	Sensing Temperature - Local [Min]	Supplied Contents	Interface
Texas Instruments TMP006BIYZFT	0°C ~ 60°C (-40°C ~ 125°C)	1 °C 1.5 °C	Digital Infrared (IR)	Surface Mount	20 °C	60 °C	5.5 V	2.2 V	15 b	I2C/SMBus	8-DSBGA	Shutdown Mode	125 °C	-40 °C	125 °C	-40 °C
Texas Instruments TMP006EVM			Temperature				5.5 V	2.7 V									Board(s) Cable(s)	I2C SPI USB
Texas Instruments TMP006BIYZFR	0°C ~ 60°C (-40°C ~ 125°C)	1 °C 1.5 °C	Digital Infrared (IR)	Surface Mount	20 °C	60 °C	5.5 V	2.2 V	15 b	I2C/SMBus	8-DSBGA	Shutdown Mode	125 °C	-40 °C	125 °C	-40 °C
Texas Instruments TMP006AIYZFT	0°C ~ 60°C (-40°C ~ 125°C)	1 °C 1.5 °C	Digital Infrared (IR)	Surface Mount	20 °C	60 °C	5.5 V	2.2 V	15 b	I2C/SMBus	8-DSBGA	Shutdown Mode	125 °C	-40 °C	125 °C	-40 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

TMP006 Series

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

TheTMP007is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.