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LMG3425R050RQZR
Integrated Circuits (ICs)

LMG3425R050RQZR

Active
Texas Instruments

600-V 50-MΩ GAN FET WITH INTEGRATED DRIVER, PROTECTION, TEMPERATURE REPORTING AND IDEAL DIODE MODE

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LMG3425R050RQZR
Integrated Circuits (ICs)

LMG3425R050RQZR

Active
Texas Instruments

600-V 50-MΩ GAN FET WITH INTEGRATED DRIVER, PROTECTION, TEMPERATURE REPORTING AND IDEAL DIODE MODE

Technical Specifications

Parameters and characteristics for this part

SpecificationLMG3425R050RQZR
Current - Output (Max) [Max]32 A
Fault ProtectionUVLO, Over Temperature, Current Limiting (Adjustable), Short Circuit
FeaturesSlew Rate Controlled, Status Flag
Input TypeNon-Inverting
InterfaceLogic, PWM
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Output ConfigurationHigh Side
Output TypeN/P-Channel
Package / Case54-VQFN Exposed Pad
Ratio - Input:Output [custom]1:1
Rds On (Typ)43 mOhm
Supplier Device Package54-VQFN (12x12)
Switch TypeGeneral Purpose
Voltage - Load [Max]600 V
Voltage - Load [Min]0 V
Voltage - Supply (Vcc/Vdd) [Max]18 V
Voltage - Supply (Vcc/Vdd) [Min]7.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 2000$ 12.60
Texas InstrumentsLARGE T&R 1$ 16.15
100$ 14.11
250$ 10.88
1000$ 9.73

Description

General part information

LMG3425R050 Series

The LMG3425R050 GaN FET with integrated driver and protection is targeted at switch-mode power converters and enables designers to achieve new levels of power density and efficiency.

The LMG3425R050 integrates a silicon driver that enables switching speed up to 150V/ns. TI’s integrated precision gate bias results in higher switching SOA compared to discrete silicon gate drivers. This integration, combined with TI’s low-inductance package, delivers clean switching and minimal ringing in hard-switching power supply topologies. Adjustable gate drive strength allows control of the slew rate from 20V/ns to 150V/ns, which can be used to actively control EMI and optimize switching performance.

Advanced power management features include digital temperature reporting, fault detection, and ideal diode mode. The temperature of the GaN FET is reported through a variable duty cycle PWM output, which simplifies managing device loading. Faults reported include overcurrent, short-circuit, overtemperature, VDD UVLO, and high-impedance RDRV pin. Ideal diode mode reduces third-quadrant losses by enabling dead-time control.