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Integrated Circuits (ICs)

BH30M0AWHFV-TR

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Rohm Semiconductor

300MA 3V, FIXED OUTPUT, HIGH-ACCURACY CMOS LDO REGULATOR

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Integrated Circuits (ICs)

BH30M0AWHFV-TR

Active
Rohm Semiconductor

300MA 3V, FIXED OUTPUT, HIGH-ACCURACY CMOS LDO REGULATOR

Technical Specifications

Parameters and characteristics for this part

SpecificationBH30M0AWHFV-TR
Control FeaturesEnable
Current - Output300 mA
Current - Quiescent (Iq)95 µA
Mounting TypeSurface Mount
Number of Regulators1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output ConfigurationPositive
Output Type1.81 mOhm
Package / Case6-SMD, Flat Leads Exposed Pad
Protection FeaturesOver Current, Over Temperature
PSRR60 dB
Supplier Device Package6-HVSOF
Voltage - Input (Max) [Max]5.5 V
Voltage Dropout (Max) [Max]0.09 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.65
10$ 0.57
25$ 0.54
100$ 0.44
250$ 0.41
500$ 0.35
1000$ 0.28
Digi-Reel® 1$ 0.65
10$ 0.57
25$ 0.54
100$ 0.44
250$ 0.41
500$ 0.35
1000$ 0.28
Tape & Reel (TR) 3000$ 0.21

Description

General part information

BH30M0AWHFV Series

BHxxM0A series are high-performance CMOS LDO regulators with output current ability of up to 300mA. These devices have excellent noise characteristics despite of their low circuit current consumption of 65µA. They are most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.

Documents

Technical documentation and resources

Thermal Resistance

Thermal Design

Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)

Schematic Design & Verification

Six Steps for Successful Thermal Design of LDO Regulator ICs

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Calculating Junction Temperature from Inrush Current

Thermal Design

Usage of SPICE Macromodel (for LDO)

Schematic Design & Verification

UL94 Flame Classifications of Mold Compound

Environmental Data

Factory Information

Manufacturing Data

BHxxM0A, BHxxMA3 Series PCB Layout

Schematic Design & Verification

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Reverse Voltage Protection

Schematic Design & Verification

Connecting LDOs in Parallel

Schematic Design & Verification

Five Steps for Successful Thermal Design of IC

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Basics of Linear Regulators

Schematic Design & Verification

Table of resistance for output voltage setting on linear regulator Ics

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Compliance with the ELV directive

Environmental Data

Problem Situations: Power Supply Does Not Start

Schematic Design & Verification

Power Source ON/OFF Characteristics for Linear Regulator

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Power Supply Sequence Circuit with General Purpose Power Supply IC

Schematic Design & Verification

HVSOF6 Package Information

Package Information

Anti-Whisker formation

Package Information

Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter

Schematic Design & Verification

EMC Measures for LDOs

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article