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ROHM QH8JC5TCR
Discrete Semiconductor Products

QH8MA2TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 30V, 4.5A, TSMT

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ROHM QH8JC5TCR
Discrete Semiconductor Products

QH8MA2TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 30V, 4.5A, TSMT

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationQH8MA2TCR
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C4.5 A, 3 A
Drain to Source Voltage (Vdss)30 V
FET FeatureLogic Level Gate
Gate Charge (Qg) (Max) @ Vgs8.4 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]365 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Power - Max [Max]1.25 W
Rds On (Max) @ Id, Vgs35 mOhm
Supplier Device PackageTSMT8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.95
10$ 0.59
100$ 0.39
500$ 0.30
1000$ 0.27
Digi-Reel® 1$ 0.95
10$ 0.59
100$ 0.39
500$ 0.30
1000$ 0.27
N/A 1229$ 0.95
Tape & Reel (TR) 3000$ 0.21
6000$ 0.20
9000$ 0.19
15000$ 0.19
21000$ 0.19
30000$ 0.19
NewarkEach (Supplied on Cut Tape) 1$ 0.91
10$ 0.60
25$ 0.53
50$ 0.46
100$ 0.39
300$ 0.35
500$ 0.30
1000$ 0.28

Description

General part information

QH8MA2 Series

The Middle Power MOSFET QH8MA2 is suitable for switching power supply.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Taping Information

Package Information

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

ESD Data

Characteristics Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models

Inner Structure

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Package Dimensions

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

TSMT8 TR Taping Spec

Datasheet