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Technical Specifications
Parameters and characteristics for this part
| Specification | CSD97396Q4M |
|---|---|
| Applications | Synchronous Buck Converters |
| Current - Output / Channel | 30 A |
| Current - Peak Output | 65 A |
| Fault Protection | Shoot-Through |
| Features | Bootstrap Circuit, Diode Emulation |
| Interface | PWM |
| Load Type | Inductive |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 8-PowerVFDFN |
| Supplier Device Package | 8-VSON (3.5x4.5) |
| Technology | Power MOSFET |
| Voltage - Load [Max] | 24 V |
| Voltage - Load [Min] | 4.5 V |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 4.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.62 | |
| 10 | $ 1.45 | |||
| 25 | $ 1.37 | |||
| 100 | $ 1.17 | |||
| 250 | $ 1.10 | |||
| 500 | $ 0.97 | |||
| Digi-Reel® | 1 | $ 1.62 | ||
| 10 | $ 1.45 | |||
| 25 | $ 1.37 | |||
| 100 | $ 1.17 | |||
| 250 | $ 1.10 | |||
| 500 | $ 0.97 | |||
| Tape & Reel (TR) | 2500 | $ 0.97 | ||
| Texas Instruments | LARGE T&R | 1 | $ 1.73 | |
| 100 | $ 1.43 | |||
| 250 | $ 1.03 | |||
| 1000 | $ 0.77 | |||
Description
General part information
CSD97396Q4M Series
The CSD97396Q4M NexFET Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.
The CSD97396Q4M NexFET Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.
Documents
Technical documentation and resources