Specification	LMZ31704RVQT

Applications	ITE (Commercial)
Control Features	Active High, Enable
Current - Output (Max) [Max]	4 A
Efficiency	95 %
Features	OTP, UVLO, OCP
Mounting Type	Surface Mount
Number of Outputs	1
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	42-BQFN Module
Size / Dimension [x]	10.2 mm
Size / Dimension [x]	0.4 in
Size / Dimension [y]	10.2 mm
Size / Dimension [y]	0.4 in
Size / Dimension [z]	4.4 mm
Size / Dimension [z]	0.17 in
Supplier Device Package	42-B3QFN (10x10)
Type	Non-Isolated PoL Module
Voltage - Input (Max) [Max]	17 V
Voltage - Input (Min) [Min]	2.95 V
Voltage - Output 1 [Max]	5.5 V
Voltage - Output 1 [Min]	0.6 V

LMZ31704 Series

2.95V to 17V, 4A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package

Part	Voltage - Output 1 [Max]	Voltage - Output 1 [Min]	Current - Output (Max) [Max]	Supplier Device Package	Voltage - Input (Min) [Min]	Package / Case	Efficiency	Operating Temperature [Max]	Operating Temperature [Min]	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [z]	Size / Dimension [x]	Size / Dimension [z]	Size / Dimension [x]	Features	Number of Outputs	Applications	Control Features	Voltage - Input (Max) [Max]	Mounting Type	Type
Texas Instruments LMZ31704RVQT	5.5 V	0.6 V	4 A	42-B3QFN (10x10)	2.95 V	42-BQFN Module	95 %	85 °C	-40 °C	10.2 mm	0.4 in	4.4 mm	10.2 mm	0.17 in	0.4 in	OCP OTP UVLO	1	ITE (Commercial)	Active High Enable	17 V	Surface Mount	Non-Isolated PoL Module

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 7.35
		5	$ 7.24
		10	$ 7.14
		25	$ 6.93
		50	$ 6.72
		100	$ 6.51
	Digi-Reel®	1	$ 7.35
		5	$ 7.24
		10	$ 7.14
		25	$ 6.93
		50	$ 6.72
		100	$ 6.51
	Tape & Reel (TR)	250	$ 6.30
		500	$ 5.88
Texas Instruments	SMALL T&R	1	$ 7.65
		100	$ 6.24
		250	$ 4.90
		1000	$ 4.16

Description

General part information

LMZ31704 Series

The LMZ31704 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31704 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.