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RH6G040BGTB1
Discrete Semiconductor Products

RH6G040BGTB1

Active
Rohm Semiconductor

MOSFET, N-CH, 40V, 95A, HSMT ROHS COMPLIANT: YES

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RH6G040BGTB1
Discrete Semiconductor Products

RH6G040BGTB1

Active
Rohm Semiconductor

MOSFET, N-CH, 40V, 95A, HSMT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRH6G040BGTB1
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs25 nC
Input Capacitance (Ciss) (Max) @ Vds1580 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)59 W
Rds On (Max) @ Id, Vgs [Max]3.6 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5503$ 2.52
NewarkEach (Supplied on Cut Tape) 1$ 2.31
10$ 1.63
25$ 1.48
50$ 1.31
100$ 1.15
250$ 1.14
500$ 0.93
1000$ 0.85

Description

General part information

RH6G040BG Series

RH6G040BG is a power MOSFET with low-on resistance and High power package, suitable for switching.

Documents

Technical documentation and resources

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

HSMT8(TB1) Dimension

Package Information

RH6G040BG Data Sheet

Data Sheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Anti-Whisker formation - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

HSMT8 Cu CRIP Inner Structure

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Types and Features of Transistors

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

Compliance of the RoHS directive

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

HSMT8(TB1) Taping Information

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

HSMT8(TB1) Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

RH6G040BG ESD Data

Characteristics Data

Technical Data Sheet EN

Datasheet