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Discrete Semiconductor Products

RD3P08BBLHRBTL

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Rohm Semiconductor

NCH 100V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

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Product dimension image
Discrete Semiconductor Products

RD3P08BBLHRBTL

Active
Rohm Semiconductor

NCH 100V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3P08BBLHRBTL
Drain to Source Voltage (Vdss)100 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 6 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]55 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]3520 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)142 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs6.2 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2484$ 3.79

Description

General part information

RD3P08BBLHRB Series

RD3P08BBLHRB is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for ADAS and Info. and Lighting and Body.

Documents

Technical documentation and resources

Anti-Whisker formation - Transistors

Package Information

Report of SVHC under REACH Regulation

Environmental Data

RD3P08BBLHRB Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RD3P08BBLHRB ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice® Models

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Package Dimensions

Package Information

TO-252_TL Taping Information

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Part Explanation

Application Note

Report of SVHC under REACH Regulation

Environmental Data

Types and Features of Transistors

Application Note

About Flammability of Materials

Environmental Data