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Discrete Semiconductor Products

UT6JE5TCR

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Rohm Semiconductor

-100V 1.0A, DUAL PCH+PCH, DFN2020-8D, POWER MOSFET

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Discrete Semiconductor Products

UT6JE5TCR

Active
Rohm Semiconductor

-100V 1.0A, DUAL PCH+PCH, DFN2020-8D, POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationUT6JE5TCR
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C1 A
Drain to Source Voltage (Vdss)100 V
Gate Charge (Qg) (Max) @ Vgs6.7 nC
Input Capacitance (Ciss) (Max) @ Vds90 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-PowerUDFN
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs840 mOhm
Supplier Device PackageHUML2020L8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3084$ 0.46

Description

General part information

UT6JE5 Series

UT6JE5 is a low on-resistance MOSFET ideal for switching applications. This product includes two -100V MOSFETs in a small surface mount package (DFN2020-8D).

Documents

Technical documentation and resources

Explanation for Marking

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

UT6JE5 Data Sheet

Data Sheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

UT6JE5 ESD Data

Characteristics Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

Package Dimensions

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Export Regulations

Export Information

P-channel Power MOSFETs selection guide

Technical Article

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design