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UMT3
Discrete Semiconductor Products

BSS138WT106

Active
Rohm Semiconductor

NCH 60V 310MA, SOT-323, SMALL SIGNAL MOSFET

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UMT3
Discrete Semiconductor Products

BSS138WT106

Active
Rohm Semiconductor

NCH 60V 310MA, SOT-323, SMALL SIGNAL MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationBSS138WT106
Current - Continuous Drain (Id) @ 25°C310 mA
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 2.5 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds15 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-323, SC-70
Power Dissipation (Max)200 mW
Rds On (Max) @ Id, Vgs2.4 Ohm
Supplier Device PackageUMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.48
10$ 0.33
100$ 0.17
500$ 0.14
1000$ 0.10
Digi-Reel® 1$ 0.48
10$ 0.33
100$ 0.17
500$ 0.14
1000$ 0.10
N/A 808$ 0.34
Tape & Reel (TR) 3000$ 0.06
6000$ 0.06
9000$ 0.06

Description

General part information

BSS138W Series

BSS138W is single Nch 60V 310mA MOSFET and ESD protection diode are included in the UMT3 package. This product is ideal for switching circuit and low-side load switch, relay driver applications.

Documents

Technical documentation and resources

Moisture Sensitivity Level - Transistors

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Package Dimensions

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Explanation for Marking

Package Information

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Taping Information

Package Information

BSS138W Data Sheet

Data Sheet

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Types and Features of Transistors

Application Note

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Reliability Test Result

Manufacturing Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

What Is Thermal Design

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification