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ONSEMI FDC6333C..
Discrete Semiconductor Products

UMX1NTN

Active
Rohm Semiconductor

BIPOLAR TRANSISTOR ARRAY, DUAL, DUAL NPN, 50 V, 150 MA, 150 MW

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ONSEMI FDC6333C..
Discrete Semiconductor Products

UMX1NTN

Active
Rohm Semiconductor

BIPOLAR TRANSISTOR ARRAY, DUAL, DUAL NPN, 50 V, 150 MA, 150 MW

Technical Specifications

Parameters and characteristics for this part

SpecificationUMX1NTN
Current - Collector (Ic) (Max) [Max]150 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition180 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-363, SC-88, 6-TSSOP
Supplier Device PackageUMT6
Transistor Type2 NPN (Dual)
Vce Saturation (Max) @ Ib, Ic400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.40
10$ 0.28
100$ 0.14
500$ 0.13
1000$ 0.10
Digi-Reel® 1$ 0.40
10$ 0.28
100$ 0.14
500$ 0.13
1000$ 0.10
N/A 3158$ 0.43
Tape & Reel (TR) 3000$ 0.09
6000$ 0.09
9000$ 0.08
30000$ 0.08
75000$ 0.06
150000$ 0.06
NewarkEach 1$ 0.44
1$ 0.44
10$ 0.27
10$ 0.27
100$ 0.13
100$ 0.13
500$ 0.11
500$ 0.11
1000$ 0.10
1000$ 0.10
2500$ 0.09
2500$ 0.09
12000$ 0.07
12000$ 0.07
27000$ 0.06
27000$ 0.06

Description

General part information

UMX1 Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Transistor, MOSFET Flammability

Related Document

UMT6 Part Marking

Related Document

UMT6 Inner Structure

Related Document

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

ESD Data

Characteristics Data

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Taping Information

Package Information

Types and Features of Transistors

Application Note

How to Create Symbols for PSpice Models

Models

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design