PCF2123U/10AA/1,00

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IC RTC CLOCK/CALENDAR SPI DIE

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Integrated Circuits (ICs)

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IC RTC CLOCK/CALENDAR SPI DIE

Technical Specifications

Parameters and characteristics for this part

Part	Current - Timekeeping (Max) [Min]	Current - Timekeeping (Max) [Max]	Mounting Type	Supplier Device Package	Package / Case	Time Format	Voltage - Supply [Min]	Voltage - Supply [Max]	Type	Operating Temperature [Max]	Operating Temperature [Min]	Interface
Freescale Semiconductor - NXP PCF2123U/10AA/1,00	0.33 µA	0.38 µA	Surface Mount	Die	Die	HH:MM:SS (12/24 hr)	1.6 V	5.5 V	Clock/Calendar	85 °C	-40 °C	SPI
Freescale Semiconductor - NXP PCF2123U/12HA/1,00	0.33 µA	0.38 µA		Die	Die	HH:MM:SS (12/24 hr)	1.6 V	5.5 V	Clock/Calendar	85 °C	-40 °C	SPI
Freescale Semiconductor - NXP PCF2123BS/1,518	0.33 µA	0.38 µA	Surface Mount	16-HVQFN (3x3)	16-VFQFN Exposed Pad	HH:MM:SS (12/24 hr)	1.6 V	5.5 V	Clock/Calendar	85 °C	-40 °C	SPI

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	6149	$ 0.52

General part information

Real Time Clock (RTC) IC Clock/Calendar SPI Die

Technical documentation and resources