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LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RFNL10BM6SFHTL

Active
Rohm Semiconductor

600V 10A, TO-252, SINGLE SUPER FAST RECOVERY DIODE FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENWhat Is Thermal Design+32
LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RFNL10BM6SFHTL

Active
Rohm Semiconductor

600V 10A, TO-252, SINGLE SUPER FAST RECOVERY DIODE FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsTechnical Data Sheet ENWhat Is Thermal Design+32

Technical Specifications

Parameters and characteristics for this part

SpecificationRFNL10BM6SFHTL
Current - Average Rectified (Io)10 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Reverse Recovery Time (trr)180 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If1.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.04
10$ 1.30
100$ 0.88
500$ 0.70
1000$ 0.64
Digi-Reel® 1$ 2.04
10$ 1.30
100$ 0.88
500$ 0.70
1000$ 0.64
Tape & Reel (TR) 2500$ 0.58
5000$ 0.54
7500$ 0.54
NewarkEach (Supplied on Cut Tape) 1$ 1.49
10$ 1.05
25$ 0.97
50$ 0.90
100$ 0.82
250$ 0.74
500$ 0.66
1000$ 0.61

Description

General part information

RFNL10BM6SFH Series

RFNL10BM6SFH is the silicon epitaxial planar type Fast Recovery Diode with ultra low forward voltage and low switching loss, suitable for general rectification or PFC (DCM : Discontinuous Current Mode).

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Inner Structure

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

About Export Regulations

Export Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions

Package Information

List of Diode Package Thermal Resistance

Thermal Design

RFNL10BM6SFH ESD Data

Characteristics Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Part Explanation

Application Note

Explanation for Marking

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Reliability Test Result

Manufacturing Data

Condition of Soldering / Land Pattern Reference

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Diode Types and Applications

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Select Rectifier Diodes

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data