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TEXAS INSTRUMENTS SN74LVC1T45DCKR
Integrated Circuits (ICs)

SN74AUP2G04DCKR

Active
Texas Instruments

2-CH, 0.8-V TO 3.6-V LOW POWER INVERTERS

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TEXAS INSTRUMENTS SN74LVC1T45DCKR
Integrated Circuits (ICs)

SN74AUP2G04DCKR

Active
Texas Instruments

2-CH, 0.8-V TO 3.6-V LOW POWER INVERTERS

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP2G04DCKR
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Current - Quiescent (Max) [Max]500 nA
Input Logic Level - High [Max]2 V
Input Logic Level - High [Min]1.6 V
Logic TypeInverter
Max Propagation Delay @ V, Max CL6.2 ns
Mounting TypeSurface Mount
Number of Circuits2
Number of Inputs2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case6-TSSOP, SC-88, SOT-363
Supplier Device PackageSC-70-6
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.41
10$ 0.35
25$ 0.33
100$ 0.26
250$ 0.24
500$ 0.21
1000$ 0.17
Digi-Reel® 1$ 0.41
10$ 0.35
25$ 0.33
100$ 0.26
250$ 0.24
500$ 0.21
1000$ 0.17
Tape & Reel (TR) 3000$ 0.17
NewarkEach (Supplied on Cut Tape) 1$ 0.77
10$ 0.74
25$ 0.72
50$ 0.70
100$ 0.68
250$ 0.67
500$ 0.65
1000$ 0.65
Texas InstrumentsLARGE T&R 1$ 0.32
100$ 0.22
250$ 0.17
1000$ 0.11

Description

General part information

SN74AUP2G04 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 1).

The SN74AUP2G04 performs the Boolean function Y =Ain positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.