Integrated Circuits (ICs)

SN74LVC1G11YZPR

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1-CH, 3-INPUT 1.65-V TO 5.5-V 32 MA DRIVE STRENGTH AND GATE

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Search across all available documentation for this part.

DocumentsImplications of Slow or Floating CMOS Inputs (Rev. E)Selecting the Right Level Translation Solution (Rev. A)+25

Integrated Circuits (ICs)

SN74LVC1G11YZPR

Active

Texas Instruments

1-CH, 3-INPUT 1.65-V TO 5.5-V 32 MA DRIVE STRENGTH AND GATE

Deep-Dive with AI

DocumentsImplications of Slow or Floating CMOS Inputs (Rev. E)Selecting the Right Level Translation Solution (Rev. A)+25

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SN74LVC1G11YZPR

Current - Output High, Low [x]	32 mA
Current - Output High, Low [y]	32 mA
Current - Quiescent (Max) [Max]	10 µA
Input Logic Level - High [Max]	2 V
Input Logic Level - High [Min]	1.7 V
Input Logic Level - Low [Max]	0.8 V
Input Logic Level - Low [Min]	0.7 V
Logic Type	AND Gate
Max Propagation Delay @ V, Max CL [Max]	3.5 ns
Mounting Type	Surface Mount
Number of Circuits	1
Number of Inputs	3
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	6-XFBGA, DSBGA
Supplier Device Package	6-DSBGA
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	1.65 V

SN74LVC1G11-EP Series

Enhanced product, 1-ch, 3-input 1.65-V to 5.5-V 32-mA drive strength AND gate

Part	Logic Type	Supplier Device Package	Number of Circuits	Mounting Type	Number of Inputs	Current - Output High, Low [y]	Current - Output High, Low [x]	Input Logic Level - Low [Max]	Input Logic Level - Low [Min]	Voltage - Supply [Max]	Voltage - Supply [Min]	Max Propagation Delay @ V, Max CL [Max]	Input Logic Level - High [Min]	Input Logic Level - High [Max]	Current - Quiescent (Max) [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Max Propagation Delay @ V, Max CL	Qualification	Grade
Texas Instruments SN74LVC1G11DCKRE4	AND Gate	SC-70-6	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V	3.5 ns	1.7 V	2 V	10 µA	125 °C	-40 °C	6-TSSOP SC-88 SOT-363
Texas Instruments SN74LVC1G11MDCKREP	AND Gate	SC-70-6	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V		1.7 V	2 V	10 µA	125 °C	-55 °C	6-TSSOP SC-88 SOT-363	5 ns
Texas Instruments SN74LVC1G11YZPR	AND Gate	6-DSBGA	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V	3.5 ns	1.7 V	2 V	10 µA	85 °C	-40 °C	6-XFBGA DSBGA
Texas Instruments SN74LVC1G11IDCKRQ1	AND Gate	SC-70-6	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V	3.5 ns	1.7 V	2 V	10 µA	85 °C	-40 °C	6-TSSOP SC-88 SOT-363		AEC-Q100	Automotive
Texas Instruments SN74LVC1G11DBVRE4	AND Gate	SOT-23-6	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V	3.5 ns	1.7 V	2 V	10 µA	125 °C	-40 °C	SOT-23-6
Texas Instruments SN74LVC1G11DRYR	AND Gate	6-SON (1.45x1)	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V	3.5 ns	1.7 V	2 V	10 µA	125 °C	-40 °C	6-UFDFN
Texas Instruments SN74LVC1G11YEPR	AND Gate	6-DSBGA	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V	3.5 ns	1.7 V	2 V	10 µA	85 °C	-40 °C	6-XFBGA DSBGA
Texas Instruments SN74LVC1G11DCKR-P	AND Gate	SC-70-6	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V		1.7 V	2 V	10 µA	125 °C	-40 °C	6-TSSOP SC-88 SOT-363	4.6 ns
Texas Instruments SN74LVC1G11DBVRG4	AND Gate	SOT-23-6	1	Surface Mount	3	32 mA	32 mA	0.8 V	0.7 V	5.5 V	1.65 V	3.5 ns	1.7 V	2 V	10 µA	125 °C	-40 °C	SOT-23-6

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.63
		10	$ 0.54
		25	$ 0.51
		100	$ 0.40
		250	$ 0.38
		500	$ 0.32
		1000	$ 0.25
	Digi-Reel®	1	$ 0.63
		10	$ 0.54
		25	$ 0.51
		100	$ 0.40
		250	$ 0.38
		500	$ 0.32
		1000	$ 0.25
	Tape & Reel (TR)	3000	$ 0.22
		6000	$ 0.21
		15000	$ 0.19
		30000	$ 0.18
Texas Instruments	LARGE T&R	1	$ 0.41
		100	$ 0.28
		250	$ 0.21
		1000	$ 0.14

Description

General part information

SN74LVC1G11-EP Series

The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y =A\ + B\ + C\in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.