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R4P030N03HZGT100
Discrete Semiconductor Products

R4P030N03HZGT100

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 30V, 3A, SOT-89 ROHS COMPLIANT: YES

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R4P030N03HZGT100
Discrete Semiconductor Products

R4P030N03HZGT100

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 30V, 3A, SOT-89 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationR4P030N03HZGT100
Current - Continuous Drain (Id) @ 25°C3 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs6.5 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]160 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-243AA
Power Dissipation (Max)500 mW
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs120 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 1.09
NewarkEach (Supplied on Cut Tape) 1$ 0.76
10$ 0.45
25$ 0.37
50$ 0.33
100$ 0.28
250$ 0.26
500$ 0.24

Description

General part information

R4P030N03HZG Series

R4P030N03HZG is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Switching

Documents

Technical documentation and resources

R4P030N03HZGT100 | Datasheet

Datasheet

Anti-Whisker formation - Transistors

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Taping Information

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Compliance of the RoHS directive

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Part Explanation

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Regulations

Export Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Explanation for Marking

Package Information

Types and Features of Transistors

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification