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BD81A24EFV-ME2
Integrated Circuits (ICs)

BD81A24EFV-ME2

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Rohm Semiconductor

4CH WHITE LED DRIVER WITH BUCK-BOOST (40 LED MAXIMUM)

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BD81A24EFV-ME2
Integrated Circuits (ICs)

BD81A24EFV-ME2

Active
Rohm Semiconductor

4CH WHITE LED DRIVER WITH BUCK-BOOST (40 LED MAXIMUM)

Technical Specifications

Parameters and characteristics for this part

SpecificationBD81A24EFV-ME2
Current - Output / Channel120 mA
DimmingPWM
Frequency [Max]2.2 MHz
Frequency [Min]200 kHz
GradeAutomotive
Internal Switch(s)False
Mounting TypeSurface Mount
Number of Outputs4
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case28-VSSOP (0.173", 4.40mm Width) Exposed Pad
QualificationAEC-Q100
Supplier Device Package28-HTSSOP-B
TopologyStep-Up (Boost), Step-Down (Buck)
TypeDC DC Controller
Voltage - Supply (Max) [Max]35 V
Voltage - Supply (Min) [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 4990$ 4.41
NewarkEach (Supplied on Cut Tape) 1$ 5.58
10$ 3.34
25$ 3.18
50$ 3.02
100$ 2.86
300$ 2.56
500$ 2.37
1000$ 2.32

Description

General part information

BD81A24EFV-M Series

BD81A24EFV-M / BD81A24MUV-M (VQFN28SV5050 package) is a white LED driver with the capability of withstanding high input voltage (35V Max). This driver has 4ch constant-current drivers integrated in 1-chip, where each channel can draw up to 120mA (Max), which is also suitable for high illumination LED drive. Furthermore, a buck-boost current mode DC/DC controller is also integrated to achieve stable operation during power voltage fluctuation. Light modulation (10,000:1 @100Hz dimming function) is possible by PWM input.

Documents

Technical documentation and resources

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

UL94 Flame Classifications of Mold Compound

Environmental Data

HTSSOP-B28 Package Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Factory Information

Manufacturing Data

Thermal Resistance

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What Is Thermal Design

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

How to Use the Two-Resistor Model

Thermal Design

ROHM Automotive Lighting Solutions

White Paper

Five Steps for Successful Thermal Design of IC

White Paper

Compliance with the ELV directive

Environmental Data

BD81A24EFV-M Data Sheet

Data Sheet

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Impact of PWM Dimming on the Conducted EMI

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Anti-Whisker formation

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Technical Data Sheet EN

Datasheet