Specification	R6006KNXC7G

Current - Continuous Drain (Id) @ 25°C	6 A
Drain to Source Voltage (Vdss)	600 V
Drive Voltage (Max Rds On, Min Rds On)	10 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]	12 nC
Input Capacitance (Ciss) (Max) @ Vds	350 pF
Mounting Type	Through Hole
Operating Temperature	150 °C
Package / Case	TO-220-3 Full Pack
Power Dissipation (Max)	40 W
Rds On (Max) @ Id, Vgs	830 mOhm
Supplier Device Package	TO-220FM
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	5.5 V

R6006 Series

600V 6A TO-220FM, High-speed switching Power MOSFET

Part	FET Type	Supplier Device Package	Input Capacitance (Ciss) (Max) @ Vds	Vgs (Max)	Current - Continuous Drain (Id) @ 25°C	Rds On (Max) @ Id, Vgs	Gate Charge (Qg) (Max) @ Vgs [Max]	Package / Case	Drive Voltage (Max Rds On, Min Rds On)	Drain to Source Voltage (Vdss)	Operating Temperature	Technology	Mounting Type	Power Dissipation (Max)	Vgs(th) (Max) @ Id	Qualification	Power Dissipation (Max) [Max]	Grade	Gate Charge (Qg) (Max) @ Vgs	Input Capacitance (Ciss) (Max) @ Vds [Max]
Rohm Semiconductor R6006KNXC7G	N-Channel	TO-220FM	350 pF	20 V	6 A	830 mOhm	12 nC	TO-220-3 Full Pack	10 V	600 V	150 °C	MOSFET (Metal Oxide)	Through Hole	40 W	5.5 V
Rohm Semiconductor R6006PND3FRATL	N-Channel	TO-252		30 V	6 A	1.2 Ohm		DPAK (2 Leads + Tab) SC-63 TO-252-3	10 V	600 V	150 °C	MOSFET (Metal Oxide)	Surface Mount		4.5 V	AEC-Q101	87 W	Automotive	15 nC	460 pF

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	769	$ 1.98
	Tube	1	$ 1.81
		50	$ 1.06
		100	$ 1.06
		500	$ 1.02
		1000	$ 0.49
		2000	$ 0.48
Newark	Each	1	$ 1.82
		10	$ 1.15
		100	$ 1.15
		500	$ 1.14
		1000	$ 1.14
		3000	$ 1.13
		5000	$ 1.12

Description

General part information

R6006 Series

R6006PND3FRA is power MOSFET with Low on-resistance and Fast switching speed by Super Junction Technology. This is a high-reliability product of automotive grade qualified to AEC-Q101, and suitable for switching applications.

Documents

Technical documentation and resources

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

R6006KNXC7G

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R6006KNXC7G

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Technical Specifications

R6006 Series

Pricing

Description

R6006 Series

Documents

Technical Data Sheet EN

θ<sub>JA</sub> and Ψ<sub>JT</sub>

What is a Thermal Model? (Transistor)

MOSFET Gate Resistor Setting for Motor Driving

Explanation for Marking

Importance of Probe Calibration When Measuring Power: Deskew

Anti-Whisker formation - Transistors

Measurement Method and Usage of Thermal Resistance RthJC

Precautions When Measuring the Rear of the Package with a Thermocouple

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Reliability Test Result

Types and Features of Transistors

Moisture Sensitivity Level - Transistors

Temperature derating method for Safe Operating Area (SOA)

Package Dimensions

Compliance of the RoHS directive

How to Use LTspice&reg; Models

Notes for Temperature Measurement Using Thermocouples

Method for Monitoring Switching Waveform

R6006KNX ESD Data

Basics of Thermal Resistance and Heat Dissipation

Part Explanation

Calculation of Power Dissipation in Switching Circuit

Judgment Criteria of Thermal Evaluation

ROHM Solution Simulator Power Device User's Guide for Inverter

MOSFET Gate Drive Current Setting for Motor Driving

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

How to Create Symbols for PSpice Models

PCB Layout Thermal Design Guide

About Export Regulations

Impedance Characteristics of Bypass Capacitor

Inner Structure

How to Use LTspice&reg; Models: Tips for Improving Convergence

About Flammability of Materials

Two-Resistor Model for Thermal Simulation

Notes for Calculating Power Consumption:Static Operation

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

What Is Thermal Design

List of Transistor Package Thermal Resistance

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

R6006 Series

How to Use LTspice® Models

How to Use LTspice® Models: Tips for Improving Convergence