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ROHM R6030ENXC7G
Discrete Semiconductor Products

R6006KNXC7G

Active
Rohm Semiconductor

600V 6A TO-220FM, HIGH-SPEED SWITCHING POWER MOSFET

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ROHM R6030ENXC7G
Discrete Semiconductor Products

R6006KNXC7G

Active
Rohm Semiconductor

600V 6A TO-220FM, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6006KNXC7G
Current - Continuous Drain (Id) @ 25°C6 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]12 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]350 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max)40 W
Rds On (Max) @ Id, Vgs830 mOhm
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 1.81
50$ 1.06
100$ 1.06
500$ 1.02
1000$ 0.49
2000$ 0.48
NewarkEach 1$ 1.82
10$ 1.15
100$ 1.15
500$ 1.14
1000$ 1.14
3000$ 1.13
5000$ 1.12

Description

General part information

R6006PND3FRA Series

R6006PND3FRA is power MOSFET with Low on-resistance and Fast switching speed by Super Junction Technology. This is a high-reliability product of automotive grade qualified to AEC-Q101, and suitable for switching applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Inner Structure

Package Information

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

ROHM Solution Simulator Power Device User's Guide for Inverter

Simulations

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Transistor)

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Types and Features of Transistors

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Explanation for Marking

Package Information

Part Explanation

Application Note