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UQFN (RSE)
Integrated Circuits (ICs)

SN74AUP3G14RSER

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Texas Instruments

3-CH, 0.8-V TO 3.6-V LOW POWER INVERTERS WITH SCHMITT-TRIGGER INPUTS

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UQFN (RSE)
Integrated Circuits (ICs)

SN74AUP3G14RSER

Active
Texas Instruments

3-CH, 0.8-V TO 3.6-V LOW POWER INVERTERS WITH SCHMITT-TRIGGER INPUTS

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP3G14RSER
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Current - Quiescent (Max) [Max]500 nA
FeaturesSchmitt Trigger
Input Logic Level - High [Max]2.29 V
Input Logic Level - High [Min]0.6 V
Input Logic Level - Low [Max]0.88 V
Input Logic Level - Low [Min]0.1 V
Logic TypeInverter
Max Propagation Delay @ V, Max CL6.2 ns
Mounting TypeSurface Mount
Number of Circuits3
Number of Inputs3
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case8-UFQFN
Supplier Device Package8-UQFN (1.5x1.5)
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.45
10$ 0.37
25$ 0.33
100$ 0.25
250$ 0.23
500$ 0.19
1000$ 0.14
2500$ 0.13
Digi-Reel® 1$ 0.45
10$ 0.37
25$ 0.33
100$ 0.25
250$ 0.23
500$ 0.19
1000$ 0.14
2500$ 0.13
Tape & Reel (TR) 5000$ 0.12
10000$ 0.11
25000$ 0.10
50000$ 0.10
Texas InstrumentsLARGE T&R 1$ 0.19
100$ 0.15
250$ 0.11
1000$ 0.08

Description

General part information

SN74AUP3G14 Series

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.

The SN74AUP3G14 contains three inverters and performs the Boolean function Y =A. The device functions as three independent inverters but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.