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Discrete Semiconductor Products

RCJ331N25TL

Active
Rohm Semiconductor

MOSFET, N-CH, 250V, 211W, TO-263S, 3PIN ROHS COMPLIANT: YES

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Product dimension image
Discrete Semiconductor Products

RCJ331N25TL

Active
Rohm Semiconductor

MOSFET, N-CH, 250V, 211W, TO-263S, 3PIN ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRCJ331N25TL
Current - Continuous Drain (Id) @ 25°C33 A
Drain to Source Voltage (Vdss)250 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs80 nC
Input Capacitance (Ciss) (Max) @ Vds4500 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
Power Dissipation (Max)1.56 W, 211 W
Supplier Device PackageTO-263S
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.27
10$ 3.51
100$ 2.50
500$ 2.08
Digi-Reel® 1$ 5.27
10$ 3.51
100$ 2.50
500$ 2.08
Tape & Reel (TR) 1000$ 1.95
NewarkEach (Supplied on Cut Tape) 1$ 5.12
10$ 3.63
25$ 3.58
50$ 3.09
100$ 2.59
250$ 2.37
500$ 2.15
1000$ 2.02

Description

General part information

RCJ331N25 Series

RCJ331N25 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What Is Thermal Design

Thermal Design

RCJ331N25 ESD Data

Characteristics Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

RCJ331N25 Data Sheet

Data Sheet

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design