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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RB161MM-20TR

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Rohm Semiconductor

SCHOTTKY DIODES & RECTIFIERS DIODE SCHOTTKY 25V 1A 2-PIN

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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RB161MM-20TR

Active
Rohm Semiconductor

SCHOTTKY DIODES & RECTIFIERS DIODE SCHOTTKY 25V 1A 2-PIN

Technical Specifications

Parameters and characteristics for this part

SpecificationRB161MM-20TR
Current - Average Rectified (Io)1 A
Current - Reverse Leakage @ Vr700 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]125 °C
Package / CaseSOD-123F
Speed500 ns, 200 mA
Supplier Device PackagePMDU
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]25 V
Voltage - Forward (Vf) (Max) @ If350 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5594$ 0.48
MouserN/A 1$ 0.48
10$ 0.30
100$ 0.18
500$ 0.14
1000$ 0.12
3000$ 0.10
6000$ 0.09
9000$ 0.09
24000$ 0.08
NewarkEach (Supplied on Cut Tape) 1$ 0.50
10$ 0.31
25$ 0.26
50$ 0.21
100$ 0.17
250$ 0.16
500$ 0.15
1000$ 0.13

Description

General part information

RB161MM-20 Series

RB161MM-20 is small power mold type (PMDU) schottky barrier diode for general rectification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Product Change Notice EN

Datasheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Anti-Whisker formation - Diodes

Package Information

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Package Dimensions

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Taping Information

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Compliance of the RoHS directive

Environmental Data

ESD Data

Characteristics Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Inner Structure

Package Information

Diode Types and Applications

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Reliability Test Result

Manufacturing Data

How to Use LTspice&reg; Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models

Report of SVHC under REACH Regulation

Environmental Data

RB161MM-20 Data Sheet

Data Sheet

How to Select Rectifier Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Explanation for Marking

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

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