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HTSSOP-B40
Integrated Circuits (ICs)

BD9397EFV-GE2

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Rohm Semiconductor

WHITE LED DRIVER FOR LARGE LCD PANEL

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HTSSOP-B40
Integrated Circuits (ICs)

BD9397EFV-GE2

Active
Rohm Semiconductor

WHITE LED DRIVER FOR LARGE LCD PANEL

Technical Specifications

Parameters and characteristics for this part

SpecificationBD9397EFV-GE2
ApplicationsBacklight
Current - Output / Channel400 mA
DimmingAnalog, PWM
Frequency500 kHz
Internal Switch(s)True
Mounting TypeSurface Mount
Number of Outputs6
Operating Temperature [Max]85 C
Operating Temperature [Min]-40 ¯C
Package / Case40-VSSOP (0.213", 5.40mm Width) Exposed Pad
Supplier Device Package40-HTSSOP-B
TopologyStep-Up (Boost)
TypeDC DC Regulator
Voltage - Supply (Max) [Max]35 V
Voltage - Supply (Min) [Min]9 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.92
10$ 1.72
25$ 1.63
100$ 1.41
250$ 1.34
500$ 1.27
Digi-Reel® 1$ 1.92
10$ 1.72
25$ 1.63
100$ 1.41
250$ 1.34
500$ 1.27
N/A 3924$ 2.68
Tape & Reel (TR) 2000$ 1.27

Description

General part information

BD9397EFV Series

BD9397EFV is a high efficiency driver for white LEDs and designed for large LCD panel. This IC is built-in high current drive and high responsibility type 6ch LED drivers and 1ch boost DCDC converter. BD9397EFV has some protect function against fault conditions, such as the over-voltage protection (OVP), LED OPEN and SHORT protection, the over current limit protection of DCDC (OCP). Therefore BD9397EFV is available for the fail-safe design over a wide range output voltage.

Documents

Technical documentation and resources

HTSSOP-B40 Package Information

Datasheet

BD9397EFV-GE2 Flammability

Related Document

What Is Thermal Design

Thermal Design

Factory Information

Manufacturing Data

BD9397EFV Data Sheet

Data Sheet

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

HTSSOP-B40 Package Information

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Thermal Resistance

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

ROHM Automotive Lighting Solutions

White Paper

Impact of PWM Dimming on the Conducted EMI

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance with the ELV directive

Environmental Data

Five Steps for Successful Thermal Design of IC

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Anti-Whisker formation

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

How to Use the Two-Resistor Model

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design