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Samtec-TMM-112-01-S-S-RA Connector Headers and PCB Receptacles Conn Unshrouded Header HDR 12 POS 2mm Solder RA Side Entry Thru-Hole Bulk
Connectors, Interconnects

TMM-113-01-G-S-RA

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 13 POS 2MM SOLDER RA SIDE ENTRY THRU-HOLE BULK

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Samtec-TMM-112-01-S-S-RA Connector Headers and PCB Receptacles Conn Unshrouded Header HDR 12 POS 2mm Solder RA Side Entry Thru-Hole Bulk
Connectors, Interconnects

TMM-113-01-G-S-RA

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 13 POS 2MM SOLDER RA SIDE ENTRY THRU-HOLE BULK

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationTMM-113-01-G-S-RA
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.51 µm
Contact Finish Thickness - Mating20 µin
Contact Finish Thickness - Post3 µin
Contact Finish Thickness - Post0.076 µm
Contact Length - Mating3.2 mm
Contact Length - Mating0.126 "
Contact Length - Post [x]0.12 in
Contact Length - Post [x]3.05 mm
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)3.2 A
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height0.079 in
Insulation Height2 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Mounting TypeThrough Hole, Right Angle
Number of Positions13
Number of Positions LoadedAll
Number of Rows1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating [x]0.079 in
Pitch - Mating [x]2 mm
ShroudingUnshrouded
StyleBoard to Board, Cable
TerminationSolder
...
PartContact Finish Thickness - PostContact Finish Thickness - PostContact TypeContact Finish Thickness - MatingContact Finish Thickness - MatingTerminationContact ShapeStyleMounting TypeContact Length - Post [x]Contact Length - Post [x]Number of Positions LoadedContact Length - MatingContact Length - MatingCurrent Rating (Amps)Insulation MaterialContact Finish - PostPitch - Mating [x]Pitch - Mating [x]Fastening TypeNumber of PositionsShroudingContact MaterialOperating Temperature [Min]Operating Temperature [Max]Insulation ColorInsulation HeightInsulation HeightConnector TypeContact Finish - MatingNumber of RowsFeaturesRow Spacing - MatingRow Spacing - MatingMaterial Flammability RatingOverall Contact LengthOverall Contact LengthContact Length - PostContact Length - PostOverall Contact Length
3 µin
0.076 µm
Male Pin
0.51 µm
20 µin
Solder
Square
Board to Board
Cable
Through Hole
Right Angle
0.12 in
3.05 mm
All
3.2 mm
0.126 "
3.2 A
Liquid Crystal Polymer (LCP)
Gold
0.079 in
2 mm
Push-Pull
13
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.079 in
2 mm
Header
Gold
1
Male Pin
0.25 çm
10 çin
Solder
Square
Board to Board
Cable
Surface Mount
All
3.2 mm
0.126 "
3.2 A
Liquid Crystal Polymer (LCP)
Tin
0.079 in
2 mm
Push-Pull
26
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.059 "
1.5 mm
Header
Gold
2
Board Guide
0.079 in
2 mm
UL94 V-0
Male Pin
Solder
Square
Board to Board
Cable
Surface Mount
All
4.27 mm
0.168 in
3.2 A
Liquid Crystal Polymer (LCP)
Tin
0.079 in
2 mm
Push-Pull
13
Unshrouded
Phosphor Bronze
-55 °C
105 ░C
Black
0.059 "
1.5 mm
Header
1
UL94 V-0
TMM-1xx-01-x-S
Samtec Inc.
Male Pin
0.76 Ám
30 Áin
Solder
Square
Board to Board
Cable
Through Hole
0.106 in
2.69 mm
All
4 mm
0.157 in
3.2 A
Liquid Crystal Polymer (LCP)
Tin
0.079 in
2 mm
Push-Pull
13
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.059 "
1.5 mm
Header
Gold
1
8.2 mm
0.323 in
3 µin
0.076 µm
Male Pin
0.51 µm
20 µin
Solder
Square
Board to Board
Cable
Surface Mount
All
1.65 mm
0.065 in
3.2 A
Liquid Crystal Polymer (LCP)
Gold
0.079 in
2 mm
Push-Pull
26
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.059 "
1.5 mm
Header
Gold
2
Pick and Place
0.079 in
2 mm
UL94 V-0
FleXYZ TMM
Samtec Inc.
3 µin
0.076 µm
Male Pin
0.51 µm
20 µin
Solder
Square
Board to Board
Cable
Through Hole
All
1.65 mm
0.065 in
3.2 A
Liquid Crystal Polymer (LCP)
Gold
0.079 in
2 mm
Push-Pull
26
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.059 "
1.5 mm
Header
Gold
2
0.079 in
2 mm
5.43 mm
0.09 "
2.29 mm
0.214 in
Male Pin
0.25 çm
10 çin
Solder
Square
Board to Board
Cable
Surface Mount
All
3.2 mm
0.126 "
3.2 A
Liquid Crystal Polymer (LCP)
Tin
0.079 in
2 mm
Push-Pull
26
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.059 "
1.5 mm
Header
Gold
2
0.079 in
2 mm
UL94 V-0
Male Pin
0.076 µm
3 µin
Solder
Square
Board to Board
Cable
Surface Mount
All
3.2 mm
0.126 "
3.2 A
Liquid Crystal Polymer (LCP)
Tin
0.079 in
2 mm
Push-Pull
26
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.059 "
1.5 mm
Header
Gold
2
0.079 in
2 mm
UL94 V-0
Male Pin
0.25 çm
10 çin
Solder
Square
Board to Board
Cable
Surface Mount
All
3.2 mm
0.126 "
3.2 A
Liquid Crystal Polymer (LCP)
Tin
0.079 in
2 mm
Push-Pull
26
Unshrouded
Phosphor Bronze
-55 °C
125 °C
Black
0.059 "
1.5 mm
Header
Gold
2
Pick and Place
0.079 in
2 mm
UL94 V-0

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 2.26
50$ 1.94
100$ 1.65
500$ 1.41
DigikeyBulk 1$ 2.26

Description

General part information

TMM-113 Series

Connector Header Through Hole, Right Angle 13 position 0.079" (2.00mm)

Documents

Technical documentation and resources