Part	Function	Voltage - Input (Max) [Max]	Number of Outputs	Voltage - Input (Min) [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Topology	Supplier Device Package [x]	Supplier Device Package	Supplier Device Package [y]	Mounting Type	Voltage - Output (Min/Fixed)	Current - Output	Package / Case	Frequency - Switching	Output Type	Output Configuration
ON Semiconductor FAN4860UC54X	Step-Up	4.5 V	1	2.3 V	85 °C	-40 °C	Boost	1.23	6-WLCSP	0.88	Surface Mount	5.4 V	1 A	6-UFBGA WLCSP	3 MHz	1.81 mOhm	Positive
ON Semiconductor FAN4860UC5X
ON Semiconductor FAN4860UC5X	Step-Up	4.5 V	1	2.3 V	85 °C	-40 °C	Boost	1.23	6-WLCSP	0.88	Surface Mount	5 V	930 mA	6-UFBGA WLCSP	3 MHz	1.81 mOhm	Positive
ON Semiconductor FAN4860UC33X	Step-Up	3.2 V	1	2.3 V	85 °C	-40 °C	Boost	1.23	6-WLCSP	0.88	Surface Mount	3.3 V	650 mA	6-UFBGA WLCSP	3 MHz	1.81 mOhm	Positive
ON Semiconductor FAN4860UC33X	Step-Up	3.2 V	1	2.3 V	85 °C	-40 °C	Boost	1.23	6-WLCSP	0.88	Surface Mount	3.3 V	650 mA	6-UFBGA WLCSP	3 MHz	1.81 mOhm	Positive

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	683	$ 0.44
		683	$ 0.44
	Cut Tape (CT)	1	$ 0.97
		1	$ 0.97
ON Semiconductor	N/A	1	$ 0.33

Description

General part information

FAN4860 Series

The FAN4860 is a low-power boost regulator designed to provide a regulated 3.3 V, 5.0 V or 5.4 V output from a single cell Lithium or Li-Ion battery. Output voltage options are fixed at 3.3 V, 5.0 V, or 5.4 V with a guaranteed maximum load current of 200 mA at VIN=2.3 V and 300 mA at VIN=3.3 V. Input current in Shutdown Mode is less than 1 µA, which maximizes battery life.Light-load PFM operation is automatic and "glitch-free". The regulator maintains output regulation at no-load with as low as 37 µA quiescent current.The combination of built-in power transistors, synchronous rectification, and low supply current make the FAN4860 ideal for battery powered applications.The FAN4860 is available in 6-bump 0.4 mm pitch Wafer-Level Chip Scale Package (WLCSP) and a 6-lead 2x2 mm ultra-thin MLP package.