
SN74AUP2G79RSER
ActiveLOW-POWER DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
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SN74AUP2G79RSER
ActiveLOW-POWER DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP2G79RSER |
|---|---|
| Clock Frequency | 266 MHz |
| Current - Output High, Low [custom] | 4 mA |
| Current - Output High, Low [custom] | 4 mA |
| Function | Standard |
| Input Capacitance | 1.5 pF |
| Max Propagation Delay @ V, Max CL | 6.3 ns |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 2 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Non-Inverted |
| Package / Case | 8-UFQFN |
| Supplier Device Package | 8-UQFN (1.5x1.5) |
| Trigger Type | Positive Edge |
| Type | D-Type |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 5000 | $ 0.30 | |
| 10000 | $ 0.29 | |||
| 25000 | $ 0.28 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.63 | |
| 100 | $ 0.43 | |||
| 250 | $ 0.33 | |||
| 1000 | $ 0.22 | |||
Description
General part information
SN74AUP2G79 Series
The AUP family is TI’s premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources