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YZP-6-BGA Pkg
Integrated Circuits (ICs)

SN74AUP2G06YFPR

Obsolete
Texas Instruments

BUFFER/DRIVER 2-CH INVERTING OPEN DRAIN CMOS 6-PIN DSBGA T/R

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YZP-6-BGA Pkg
Integrated Circuits (ICs)

SN74AUP2G06YFPR

Obsolete
Texas Instruments

BUFFER/DRIVER 2-CH INVERTING OPEN DRAIN CMOS 6-PIN DSBGA T/R

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP2G06YFPR
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Current - Quiescent (Max) [Max]500 nA
FeaturesOpen Drain
Input Logic Level - High [Max]2 V
Input Logic Level - High [Min]1.6 V
Logic TypeInverter
Max Propagation Delay @ V, Max CL10.5 ns
Mounting TypeSurface Mount
Number of Circuits2
Number of Inputs2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case6-XFBGA, DSBGA
Supplier Device Package6-DSBGA
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

SN74AUP2G06 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The output of the SN74AUP2G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources

No documents available