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8-TSSOP, 8-MSOP
Integrated Circuits (ICs)

SN74AUP2G00QDCURQ1

Active
Texas Instruments

AUTOMOTIVE 2-CH, 2-INPUT, 0.8-V TO 3.6-V LOW POWER NAND GATES

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8-TSSOP, 8-MSOP
Integrated Circuits (ICs)

SN74AUP2G00QDCURQ1

Active
Texas Instruments

AUTOMOTIVE 2-CH, 2-INPUT, 0.8-V TO 3.6-V LOW POWER NAND GATES

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP2G00QDCURQ1
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Current - Quiescent (Max) [Max]500 nA
GradeAutomotive
Input Logic Level - High [Max]2 V
Input Logic Level - High [Min]1.6 V
Logic TypeNAND Gate
Max Propagation Delay @ V, Max CL7 ns
Mounting TypeSurface Mount
Number of Circuits2
Number of Inputs2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case8-VFSOP
Package / Case [y]2.3 mm
Package / Case [y]0.091 in
QualificationAEC-Q100
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.96
10$ 0.86
25$ 0.82
100$ 0.67
250$ 0.63
500$ 0.55
1000$ 0.44
Digi-Reel® 1$ 0.96
10$ 0.86
25$ 0.82
100$ 0.67
250$ 0.63
500$ 0.55
1000$ 0.44
Tape & Reel (TR) 3000$ 0.41
6000$ 0.39
15000$ 0.37
Texas InstrumentsLARGE T&R 1$ 0.83
100$ 0.56
250$ 0.43
1000$ 0.29

Description

General part information

SN74AUP2G00-Q1 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP2G00 performs the Boolean function Y =A • Bor Y =A+Bin positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.