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TO-220FN
Discrete Semiconductor Products

RBR10T60ANZC9

Active
Rohm Semiconductor

LOW VF, 60V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE

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TO-220FN
Discrete Semiconductor Products

RBR10T60ANZC9

Active
Rohm Semiconductor

LOW VF, 60V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRBR10T60ANZC9
Current - Average Rectified (Io) (per Diode)5 A
Current - Reverse Leakage @ Vr200 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-3 Full Pack
Speed200 mA, 500 ns
Supplier Device PackageTO-220FN
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]60 V
Voltage - Forward (Vf) (Max) @ If [Max]650 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 1.84
10$ 1.17
100$ 0.79
500$ 0.62

Description

General part information

RBR10NS60AFH Series

RBR10NS30AFH is the high reliability Automotive Schottky Barrier Diode, suitable for Switching power supply.

Documents

Technical documentation and resources

RBR10T60ANZ Data Sheet

Data Sheet

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What Is Thermal Design

Thermal Design

Constitution Materials List

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

ESD Data

Characteristics Data

Reliability Test Result

Manufacturing Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Taping Information

Package Information

Diode Types and Applications

Technical Article

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Power Loss and Thermal Design of Diodes

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Inner Structure

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

What is a Thermal Model? (Diode)

Thermal Design

About Export Regulations

Export Information

Explanation for Marking

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification