TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 50 Ohms | 2.7 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | 28 VDC 115 VAC | 0.22 VDC | 100 mA | 28 W 115 VA | Diode | DPDT (2 Form C) | 4 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/18 | Through Hole | 5 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 390 Ohms | 7 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | | 0.63 VDC | 30.8 mA | | Diode | DPDT (2 Form C) | 1.5 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/19 | Through Hole | 12 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 880 Ohms | 11.5 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | 28 VDC 115 VAC | 1.4 VDC | 22.1 mA | 28 W 115 VA | Diode | DPDT (2 Form C) | 4 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/19 | Through Hole | 18 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 880 Ohms | 10.5 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | 28 VDC 115 VAC | 0.91 VDC | 20.5 mA | 28 W 115 VA | Diode | DPDT (2 Form C) | 4 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/18 | Through Hole | 18 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 390 Ohms | 7 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | 28 VDC 115 VAC | 0.63 VDC | 30.8 mA | 28 W 115 VA | Diode | DPDT (2 Form C) | 4 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/18 | Through Hole | 12 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 390 Ohms | 7 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | 28 VDC 115 VAC | 0.63 VDC | 30.8 mA | 28 W 115 VA | | DPDT (2 Form C) | 1.5 ms | 125 °C | -65 ░C | Non Latching | | Through Hole | 12 VDC | 2 ms | |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 880 Ohms | 11.5 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | 28 VDC 115 VAC | 1.4 VDC | 22.1 mA | 28 W 115 VA | Diode | DPDT (2 Form C) | 4 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/19 | Through Hole | 18 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 50 Ohms | 2.7 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | | 0.22 VDC | 100 mA | | Diode | DPDT (2 Form C) | 1.5 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/18 | Through Hole | 5 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 390 Ohms | 7 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | | 0.63 VDC | 30.8 mA | | | DPDT (2 Form C) | 1.5 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/17 | Through Hole | 12 VDC | 2 ms | Military |
TE Connectivity Aerospace, Defense and Marine | Sealed - Hermetically | PC Pin | 50 Ohms | 2.7 VDC | 1 A | General Purpose | Gold (Au) Silver Palladium (AgPd) | | 0.22 VDC | 100 mA | | Diode | DPDT (2 Form C) | 1.5 ms | 125 °C | -65 ░C | Non Latching | MIL-R-39016/19 | Through Hole | 5 VDC | 2 ms | Military |