Soldering, Desoldering, Rework Products

NC2SW.015 0.2OZ

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SOLDER WIRE MINI POCKET PACK 60/

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Soldering, Desoldering, Rework Products

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SOLDER WIRE MINI POCKET PACK 60/

Technical Specifications

Parameters and characteristics for this part

Part	Melting Point [Max]	Melting Point [Min]	Type	Wire Gauge	Process	Composition	Form	Form	Form	Flux Type	Diameter [diameter]	Diameter [diameter]	Melting Point	Melting Point	Melting Point [Max]	Melting Point [Min]	Melting Point [Min]	Melting Point [Max]	Form
Chip Quik Inc. NC2SW.020 0.3OZ	188 °C 370 °F	183 °C 361 °F	Wire Solder	24 AWG 25 mmý	Leaded	Sn60Pb40 (60/40)	8.51 g	0.3 oz	Tube	No-Clean	0.02 in	0.51 mm
Chip Quik Inc. NC2SWLF.015 2OZ			Wire Solder			Sn99.3Cu0.7 (99.3/0.7)	56.7 g	2 oz	Spool	No-Clean	0.015 in	0.38 mm	441 °F	227 °C
Chip Quik Inc. NC2SW.015 2OZ			Wire Solder		Leaded	Sn60Pb40 (60/40)	56.7 g	2 oz	Spool	No-Clean	0.015 in	0.38 mm			188 °C	183 °C	361 °F	370 °F
Chip Quik Inc. NC2SWLF.015 8OZ			Wire Solder			Sn99.3Cu0.7 (99.3/0.7)	226.8 g	8 oz	Spool	No-Clean	0.015 in	0.38 mm	441 °F	227 °C
Chip Quik Inc. NC2SWLF.015 0.2OZ			Wire Solder			Sn99.3Cu0.7 (99.3/0.7)	5.66 g	0.2 oz	Tube	No-Clean	0.015 in	0.38 mm	441 °F	227 °C
Chip Quik Inc. NC2SWLF.015 1LB			Wire Solder			Sn99.3Cu0.7 (99.3/0.7)	16 oz	1 lb	Spool	No-Clean	0.015 in	0.38 mm	441 °F	227 °C
Chip Quik Inc. NC2SW.015 1LB			Wire Solder		Leaded	Sn60Pb40 (60/40)	16 oz	1 lb	Spool	No-Clean	0.015 in	0.38 mm			188 °C	183 °C	361 °F	370 °F
Chip Quik Inc. NC2SW.015 0.2OZ			Wire Solder		Leaded	Sn60Pb40 (60/40)	5.66 g	0.2 oz	Tube	No-Clean	0.015 in	0.38 mm			188 °C	183 °C	361 °F	370 °F
Chip Quik Inc. NC2SWLF.015 1OZ			Wire Solder			Sn99.3Cu0.7 (99.3/0.7)	1 oz		Spool	No-Clean	0.015 in	0.38 mm	441 °F	227 °C					28.35 g
Chip Quik Inc. NC2SW.015 4OZ			Wire Solder		Leaded	Sn60Pb40 (60/40)	113.4 g	4 oz	Spool	No-Clean	0.015 in	0.38 mm			188 °C	183 °C	361 °F	370 °F