Zenode.ai Logo
AS4C64M16D3B-12BCN
Integrated Circuits (ICs)

AS4C64M16D3B-12BCN

Active
Alliance Memory, Inc.

DRAM DDR3, 1G, 64M X 16, 1.5V, 96-BALL FBGA, 800MHZ, (B-DIE), COMMERCIAL TEMP - TRAY

Deep-Dive with AI

Search across all available documentation for this part.

AS4C64M16D3B-12BCN
Integrated Circuits (ICs)

AS4C64M16D3B-12BCN

Active
Alliance Memory, Inc.

DRAM DDR3, 1G, 64M X 16, 1.5V, 96-BALL FBGA, 800MHZ, (B-DIE), COMMERCIAL TEMP - TRAY

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationAS4C64M16D3B-12BCN
Access Time20 ns
Clock Frequency800 MHz
Memory Depth64 M
Memory FormatDRAM
Memory Interface (Type)Parallel
Memory Size1 Gbit
Memory TypeVolatile
Memory Width16 bit
Mounting TypeSurface Mount
Operating Temperature (Max)95 °C
Operating Temperature (Min)0 °C
Package / Case96-TFBGA
Package Length9 mm
Package Name96-FBGA
Package Width13 mm
TechnologySDRAM - DDR3
Voltage - Supply (Maximum)1.575 V
Voltage - Supply (Minimum)1.425 V
Write Cycle Time - Page15 ns
Write Cycle Time - Word15 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyTray 1$ 9.18<2d
10$ 8.54
25$ 8.28
50$ 8.08
190$ 7.71
380$ 7.51
570$ 7.40
1140$ 7.22
MouserN/A 1$ 6.071m+
10$ 5.66
25$ 5.40
100$ 5.11
190$ 4.93
570$ 4.69
1140$ 4.58

CAD

3D models and CAD resources for this part

Description

General part information

AS4C64M16D3B Series

DRAM DDR3, 1G, 64M X 16, 1.5V, 96-BALL FBGA, 800MHZ, (B-DIE), COMMERCIAL TEMP - TRAY

Documents

Technical documentation and resources

No documents available