Integrated Circuits (ICs)

MC33PF8201A0ESR2

Active

POWER MANAGEMENT IC, I.MX8, NON-PROG, 5 BUCK, 3 LDO, ASIL-B, AUTO, QFN 56/ REEL ROHS COMPLIANT: YES

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Integrated Circuits (ICs)

Active

POWER MANAGEMENT IC, I.MX8, NON-PROG, 5 BUCK, 3 LDO, ASIL-B, AUTO, QFN 56/ REEL ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification	MC33PF8201A0ESR2

Applications	High Performance i.MX 8 Processor Based
Mounting Type	Wettable Flank, Surface Mount
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Package / Case	56-VFQFN Exposed Pad
Supplier Device Package	56-HVQFN (8x8)
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	2.5 V

Part	Applications	Supplier Device Package	Mounting Type	Package / Case	Voltage - Supply [Min]	Voltage - Supply [Max]	Operating Temperature [Max]	Operating Temperature [Min]
Freescale Semiconductor - NXP MC33PF8201A0ESR2	High Performance i.MX 8 Processor Based	56-HVQFN (8x8)	Surface Mount Wettable Flank	56-VFQFN Exposed Pad	2.5 V	5.5 V	105 °C	-40 °C
Freescale Semiconductor - NXP MC33PF8201A0ES	High Performance i.MX 8 Processor Based	56-HVQFN (8x8)	Surface Mount Wettable Flank	56-VFQFN Exposed Pad	2.5 V	5.5 V	105 °C	-40 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	4000	$ 6.56
Newark	Each	500	$ 5.82

General part information

High Performance i.MX 8 Processor Based PMIC 56-HVQFN (8x8)

Technical documentation and resources