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ROHM BM63963S-VC
Discrete Semiconductor Products

BM63564S-VC

Active
Rohm Semiconductor

600V IGBT INTELLIGENT POWER MODULE (IPM) FOR LOW SPEED SWITCHING DRIVE

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENConstitution Materials List+24
ROHM BM63963S-VC
Discrete Semiconductor Products

BM63564S-VC

Active
Rohm Semiconductor

600V IGBT INTELLIGENT POWER MODULE (IPM) FOR LOW SPEED SWITCHING DRIVE

Deep-Dive with AI

DocumentsTechnical Data Sheet ENConstitution Materials List+24

Technical Specifications

Parameters and characteristics for this part

SpecificationBM63564S-VC
Configuration3 Phase Inverter
Current15 A
Mounting TypeThrough Hole
TypeIGBT
Voltage600 V
Voltage - Isolation1500 VAC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 58$ 25.45
Tube 1$ 18.01
60$ 15.35
NewarkEach 1$ 15.97
5$ 15.97
10$ 15.97
25$ 15.97
50$ 15.96
120$ 15.96
300$ 15.96

Description

General part information

BM63564 Series

BM63564S-VC is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes. Low saturation voltage IGBTs optimized for low speed switching drive (to 6kHz) such as a compressor is adopted. Please examine high speed switching series for high speed switching drive.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Constitution Materials List

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

BM63564S-VC Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Administration Regulations (EAR)

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the ELV directive

Environmental Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Anti-Whisker formation

Package Information

PCB Layout Thermal Design Guide

Thermal Design

About Flammability of Materials

Environmental Data

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification