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RUC002N05T116
Discrete Semiconductor Products

BSS5130AT116

Active
Rohm Semiconductor

PNP, SOT-23, -30V -1A, GENERAL PURPOSE AMPLIFICATION TRANSISTOR

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RUC002N05T116
Discrete Semiconductor Products

BSS5130AT116

Active
Rohm Semiconductor

PNP, SOT-23, -30V -1A, GENERAL PURPOSE AMPLIFICATION TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationBSS5130AT116
Current - Collector (Ic) (Max) [Max]1 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition320 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
Supplier Device PackageSST3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic380 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.58
10$ 0.36
100$ 0.23
500$ 0.17
1000$ 0.15
Digi-Reel® 1$ 0.58
10$ 0.36
100$ 0.23
500$ 0.17
1000$ 0.15
N/A 96$ 0.58
Tape & Reel (TR) 3000$ 0.13
6000$ 0.12
9000$ 0.11
15000$ 0.11
21000$ 0.10
30000$ 0.10
75000$ 0.09

Description

General part information

BSS5130A Series

BSS513A0 is a SOT-23 package Transistor for low frequency amplifier.

Documents

Technical documentation and resources

Types and Features of Transistors

Application Note

Compliance of the RoHS directive

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

BSS5130A Data Sheet

Data Sheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Part Explanation

Application Note

About Export Regulations

Export Information

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

How to Create Symbols for PSpice Models

Models

Anti-Whisker formation - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification