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RB055L-60DDTE25
Discrete Semiconductor Products

RB055L-60DDTE25

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Rohm Semiconductor

SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)

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RB055L-60DDTE25
Discrete Semiconductor Products

RB055L-60DDTE25

Active
Rohm Semiconductor

SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

SpecificationRB055L-60DDTE25
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr70 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseDO-214AC, SMA
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackagePMDS
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]60 V
Voltage - Forward (Vf) (Max) @ If680 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2670$ 0.75

Description

General part information

RB055L-60DD Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for PC,mobile phone and various portable electronics.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

RB055L-60DD Data Sheet

Data Sheet

What is a Thermal Model? (Diode)

Thermal Design

RB055L-60DD ESD Data

Characteristics Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

Taping Information

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Diode Types and Applications

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Flammability of Materials

Environmental Data

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Package Dimensions

Package Information

Anti-Whisker formation - Diodes

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Explanation for Marking

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information

Part Explanation

Application Note