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YQ15RSM10SDTFTL1
Discrete Semiconductor Products

RFN10RSM2STFTL1

Active
Rohm Semiconductor

200V 10A 15NS, TO-277A, ULTRA FAST RECOVERY DIODE FOR AUTOMOTIVE

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YQ15RSM10SDTFTL1
Discrete Semiconductor Products

RFN10RSM2STFTL1

Active
Rohm Semiconductor

200V 10A 15NS, TO-277A, ULTRA FAST RECOVERY DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN10RSM2STFTL1
Current - Average Rectified (Io)10 A
Current - Reverse Leakage @ Vr1 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / Case3-PowerDFN, TO-277
QualificationAEC-Q101
Reverse Recovery Time (trr)25 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-277A
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If960 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.04
10$ 1.30
25$ 1.11
100$ 0.89
250$ 0.78
500$ 0.71
1000$ 0.66
Digi-Reel® 1$ 2.04
10$ 1.30
25$ 1.11
100$ 0.89
250$ 0.78
500$ 0.71
1000$ 0.66
Tape & Reel (TR) 4000$ 0.58
8000$ 0.55
12000$ 0.53
NewarkEach (Supplied on Cut Tape) 1$ 1.42
10$ 1.15
25$ 1.09
50$ 1.02
100$ 0.95
250$ 0.90
500$ 0.85
1000$ 0.79

Description

General part information

RFN10RSM2STF Series

RFN10RSM2STF is a silicon epitaxial planar type ultra fast recovery diode featuring low VFand low switching loss. Ideal for general rectification applications.

Documents

Technical documentation and resources

What is a Thermal Model? (Diode)

Thermal Design

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Diode Types and Applications

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

RFN10RSM2STF Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

TO-277GE Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Select Rectifier Diodes

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

Judgment Criteria of Thermal Evaluation

Thermal Design